Thermal interface materials (TIMs) play a critical role in thermal management of electronic assemblies to improve thermal contact between parts, such as a component and heatsink.

Simcenter™ DYNTIM™ hardware offers a smart implementation of the ASTM D5470 standard, based on transient rather than steady-state measurements, with highly accurate bond line thickness control in 1 µm steps to maximize measurement accuracy. Automated control of sample thickness or pressure makes it ideal for soft samples (greases, pastes, gap pads, phase-change materials etc.) and specially-prepared metallic samples, complementing existing thermal conductivity test systems, e.g. laser flash.

Our product, available as a stand-alone system or as a fixture for Simcenter T3STER™, fully automates the measurement process, saving time and effort, while delivering ±5% repeatability under measurement conditions close to the real application. Due to its simplicity and robustness, the system can be operated by almost anyone after a short training session to give operator-independent results.